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. Remove the IP-X motherboard layered, we use 185-degree layered process,

not only From our fine analysis of IP-X solder paste,

but also depends on the special heating design and precise temperature control of SS-T12A.

2. Only heating the area that the IP-X board needs to be removed to prevent improper heating.
3. Dual bayonet design ,make sure the IP-X motherboard is stable on the stage.
4. High purity copper is used as a film to ensure uniform heat transfer and heat.